Title : 
Smart sensor with dual standard fieldbus interconnection capability
         
        
            Author : 
Dobrescu, Radu ; Vasilescu, Constantin ; Andone, Daniela ; Dobrescu, Matei
         
        
            Author_Institution : 
Control & Ind. Informatics Dept., ´´Politehnica´´ Univ., Bucharest, Romania
         
        
        
        
        
        
            Abstract : 
We propose a temperature smart sensor (TSS) having the capability of interconnection on fieldbuses compatible both with IEC 61158 and EN 50170 standards. In this aim TSS has a versatile programmable electrical interface corresponding to the TIA/EIA-485-A standard. The communication protocol supports both the IEC 870-5-1 specification of Telecontrol Equipment and Systems and the Fieldbus Foundation specification for isochronous transmission. TSS utilizes thermocouples or thermo resistances as sensitive elements, so several types and ranges are available. The paper presents the hardware and software architecture, with details on the communication interface and software. A dedicated section refers to the local software facilities and insists on the versatility in programming functional parameters. Finally, some of the advantages in industrial control applications of this device are underlined
         
        
            Keywords : 
IEC standards; field buses; intelligent sensors; temperature sensors; EN 50170; Fieldbus Foundation specification; IEC 61158; IEC 870-5-1 specification; TIA/EIA-485-A standard; communication protocol; dual standard fieldbus interconnection capability; hardware architecture; isochronous transmission; local software facilities; software architecture; temperature smart sensor; Field buses; Functional programming; Hardware; IEC standards; Industrial control; Intelligent sensors; Protocols; Software architecture; Telecontrol equipment; Temperature sensors;
         
        
        
        
            Conference_Titel : 
Control Applications, 2001. (CCA '01). Proceedings of the 2001 IEEE International Conference on
         
        
            Conference_Location : 
Mexico City
         
        
            Print_ISBN : 
0-7803-6733-2
         
        
        
            DOI : 
10.1109/CCA.2001.974032