• DocumentCode
    2065681
  • Title

    Robust current-mode on-chip interconnect signaling scheme in deep submicron

  • Author

    Xinsheng Wang ; Mingyang Hu ; Yu Mingyan

  • Author_Institution
    Microelectron. Center, Harbin Inst. of Technol., Harbin, China
  • fYear
    2013
  • fDate
    28-31 Oct. 2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    In this paper, we propose a novel process-variation robust current-mode signaling scheme for on-chip interconnects. By using special bias generation circuits in the driver, the current-mode signaling system is robust in the presence of process induced parameter variations and uncertainties. Different process corners and Monte Carlo simulation analyses are carried out using Hspice in Chartered Semiconductor 0.18 micrometer process. The process corner simulation analyses show that the average power and system delay don´t change much in different process corner, especially in typical, FS and SF corner. Monte Carlo analyses show that the average delay and power of the interconnect signaling system are normally distributed for a 10mm wire in 180 nm process technology.
  • Keywords
    Monte Carlo methods; VLSI; current-mode circuits; integrated circuit interconnections; integrated circuit modelling; signalling; Chartered semiconductor process; Hspice; Monte Carlo simulation analyses; VLSI technology; bias generation circuits; deep submicron; process corner simulation analyses; process induced parameter uncertainty; process induced parameter variations; process-variation robust current-mode signaling scheme; robust current-mode on-chip interconnect signaling scheme; size 0.18 mum; very large scale integrated circuit; Communication system signaling; Delays; Integrated circuit interconnections; Receivers; Robustness; System-on-chip; Wires; Global interconnect; Monte Carlo; current-mode;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    ASIC (ASICON), 2013 IEEE 10th International Conference on
  • Conference_Location
    Shenzhen
  • ISSN
    2162-7541
  • Print_ISBN
    978-1-4673-6415-7
  • Type

    conf

  • DOI
    10.1109/ASICON.2013.6811910
  • Filename
    6811910