DocumentCode
2065681
Title
Robust current-mode on-chip interconnect signaling scheme in deep submicron
Author
Xinsheng Wang ; Mingyang Hu ; Yu Mingyan
Author_Institution
Microelectron. Center, Harbin Inst. of Technol., Harbin, China
fYear
2013
fDate
28-31 Oct. 2013
Firstpage
1
Lastpage
4
Abstract
In this paper, we propose a novel process-variation robust current-mode signaling scheme for on-chip interconnects. By using special bias generation circuits in the driver, the current-mode signaling system is robust in the presence of process induced parameter variations and uncertainties. Different process corners and Monte Carlo simulation analyses are carried out using Hspice in Chartered Semiconductor 0.18 micrometer process. The process corner simulation analyses show that the average power and system delay don´t change much in different process corner, especially in typical, FS and SF corner. Monte Carlo analyses show that the average delay and power of the interconnect signaling system are normally distributed for a 10mm wire in 180 nm process technology.
Keywords
Monte Carlo methods; VLSI; current-mode circuits; integrated circuit interconnections; integrated circuit modelling; signalling; Chartered semiconductor process; Hspice; Monte Carlo simulation analyses; VLSI technology; bias generation circuits; deep submicron; process corner simulation analyses; process induced parameter uncertainty; process induced parameter variations; process-variation robust current-mode signaling scheme; robust current-mode on-chip interconnect signaling scheme; size 0.18 mum; very large scale integrated circuit; Communication system signaling; Delays; Integrated circuit interconnections; Receivers; Robustness; System-on-chip; Wires; Global interconnect; Monte Carlo; current-mode;
fLanguage
English
Publisher
ieee
Conference_Titel
ASIC (ASICON), 2013 IEEE 10th International Conference on
Conference_Location
Shenzhen
ISSN
2162-7541
Print_ISBN
978-1-4673-6415-7
Type
conf
DOI
10.1109/ASICON.2013.6811910
Filename
6811910
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