• DocumentCode
    2065756
  • Title

    Improved unified interconnect unit for high speed and scalable FPGA

  • Author

    Lei Li ; Jian Wang ; Jinmei Lai

  • Author_Institution
    State Key Lab. of ASIC & Syst., Fudan Univ., Shanghai, China
  • fYear
    2013
  • fDate
    28-31 Oct. 2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This paper presents a completely unified interconnect unit (UINT) including unified input and output multiplexers (UIM and UOM) which are usually non-repeatable [1-3]. UINT ensures different logic modules could have exactly the identical interconnect circuit, providing higher scalability for FPGAs. Furthermore, Multi-Vt switch circuit combining low threshold voltage and high threshold voltage transistors is put forward to minimize the adverse effects brought by threshold voltage loss and decrease of Supply Voltage in Nanometer technology, attaining high speed performance of FPGA. The proposed interconnect unit is applied to own-designed Fudan Programmable (FDP5) FPGA and realized through 65 nm technology. Post-layout simulation results indicate that the proposed interconnect circuit is well-designed with up to 40% improvement of speed performance compared to the prior work [3] equivalent to the same technology, yet maintaining lower power consumption and smaller area, reduced by 12% and 35% respectively.
  • Keywords
    field programmable gate arrays; integrated circuit interconnections; logic design; low-power electronics; FDP5; Fudan programmable FPGA; UIM; UINT; UOM; high speed FPGA; high threshold voltage transistors; identical interconnect circuit; logic modules; multi-Vt switch circuit; nanometer technology; power consumption; scalable FPGA; size 65 nm; speed performance; supply voltage; unified input multiplexers; unified interconnect unit; unified output multiplexers; Delays; Field programmable gate arrays; Integrated circuit interconnections; Multiplexing; Switching circuits; Threshold voltage; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    ASIC (ASICON), 2013 IEEE 10th International Conference on
  • Conference_Location
    Shenzhen
  • ISSN
    2162-7541
  • Print_ISBN
    978-1-4673-6415-7
  • Type

    conf

  • DOI
    10.1109/ASICON.2013.6811912
  • Filename
    6811912