Title :
Proceedings of the 1997 1st Electronic Packaging Technology Conference (Cat. No.97TH8307)
Abstract :
The following topics were dealt with: packaging and assembly; thermal management; package reliability; electronics cooling; thermomechanical stress analysis; interfacial adhesion; packaging materials; flip chip technology; and test methods
Keywords :
adhesion; assembling; cooling; electronic equipment testing; flip-chip devices; packaging; reliability; stress analysis; assembly; electronics cooling; flip chip technology; interfacial adhesion; package reliability; packaging materials; test methods; thermal management; thermomechanical stress analysis;
Conference_Titel :
Electronic Packaging Technology Conference, 1997. Proceedings of the 1997 1st
Conference_Location :
Singapore
Print_ISBN :
0-7803-4157-0
DOI :
10.1109/EPTC.1997.723876
