• DocumentCode
    2066170
  • Title

    Parameter and UVM, making a layered testbench powerful

  • Author

    Geng Zhong ; Jian Zhou ; Bei Xia

  • Author_Institution
    Dept. of Microcontroller, Freescale, Suzhou, China
  • fYear
    2013
  • fDate
    28-31 Oct. 2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Parameterized design is highly increasing the flexibility and reusability of the integrated circuit. Meanwhile, it requires additional verification effort over verifying an un-parameterized design. Consequently, flexible verification strategies must be developed to ensure the verification process of parameterized design. UVM was built on the principle of cooperation between EDA vendors and customers. It is based on SystemVerilog classes, and proven to be a powerful OOP technique with highly reusability. In this case, how to develop a parameterized UVM testbench is a major concern. This paper demonstrates a method that has proven useful within a layered UVM testbench. First, this paper discusses how to create parameterized UVM. Then, it focuses on parameterized interconnection and interoperable (Layer-Layer Communication and DUT-TB Communication).At last, to illustrate the method, a parameterized UVM env based on the method is developed. It is proven useful in different kinds of scenarios.
  • Keywords
    electronic design automation; integrated circuit design; integrated circuit testing; object-oriented programming; program verification; EDA customers; EDA vendors; OOP technique; SystemVerilog classes; electronic design automation; flexible verification strategy; integrated circuit; layered testbench; object orientated programming; parameterized UVM testbench; parameterized design; parameterized interconnection; un-parameterized design; universal verification methodology; Abstracts; Focusing; Hardware design languages; Integrated circuit interconnections; Monitoring; Ports (Computers); System-on-chip;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    ASIC (ASICON), 2013 IEEE 10th International Conference on
  • Conference_Location
    Shenzhen
  • ISSN
    2162-7541
  • Print_ISBN
    978-1-4673-6415-7
  • Type

    conf

  • DOI
    10.1109/ASICON.2013.6811929
  • Filename
    6811929