Thermal management of microelectronics in the 21st century

Author

Bar-Cohen, Avram

Author_Institution

Dept. of Mech. Eng., Minnesota Univ., Minneapolis, MN, USA

fYear

1997

fDate

8-10 Oct 1997

Firstpage

29

Lastpage

33

Abstract

The challenges posed by high chip heat fluxes and ever more stringent performance and reliability constraints make thermal management a key enabling technology in the development of microelectronic systems for the 21st century. Thermal packaging efforts must thus be performed in the context of the salient trends and parameters that characterize the IC technology and electronic products industries. Enhanced, air-cooled heat sinks and passive immersion modules are two quite distinct thermal packaging technologies that may play a pivotal role in future electronic systems

Keywords

cooling; heat sinks; integrated circuit packaging; integrated circuit reliability; technological forecasting; IC technology; air-cooled heat sinks; chip heat flux; electronic products; electronic systems; microelectronic systems; microelectronics; passive immersion modules; performance constraints; reliability constraints; thermal management; thermal packaging; thermal packaging technology; CMOS technology; Consumer electronics; Electronic packaging thermal management; Electronics packaging; Heat sinks; Microelectronics; Semiconductor device packaging; Technology management; Thermal management; Thermal management of electronics;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology Conference, 1997. Proceedings of the 1997 1st

Print_ISBN

0-7803-4157-0

Type

conf

DOI

10.1109/EPTC.1997.723880

Filename

723880