Title :
Compliant bump technology for back-side illuminated CMOS image sensor
Author :
Asano, Tanemasa ; Watanabe, Naoya ; Tsunoda, Isao ; Kimiya, Yasuhiro ; Fukunaga, Katsuaki ; Handa, Minoru ; Arao, Hiroki ; Yamaji, Yasuhiro ; Aoyagi, Masahiro ; Higashimachi, Takao ; Tanaka, Koichiro ; Takao, Takayuki ; Matsumura, Kohei ; Ikeda, Akihiro ;
Author_Institution :
Kyushu Univ., Fukuoka
Abstract :
We have developed a compliant bump technology for 3D chip stacking with the same number of inter-chip connections as that in a VGA (video graphic array, 640 times 480). Using this technology together with a through-Si via (TSV) technology, we demonstrate a prototype of back-side illuminated CMOS image sensor, in which a very-thin rear-illuminated photodiode array is electrically connected to the CMOS readout circuit at a pixel level.
Keywords :
CMOS image sensors; photodetectors; photodiodes; readout electronics; silicon; 3D chip stacking; VGA; back-side illuminated CMOS image sensor; compliant bump technology; interchip connection; photodiode array; video graphic array; CMOS image sensors; CMOS technology; Circuits; Graphics; Photodiodes; Pixel; Prototypes; Sensor arrays; Stacking; Through-silicon vias;
Conference_Titel :
Electronic Components and Technology Conference, 2009. ECTC 2009. 59th
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-4475-5
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2009.5073994
