Title :
Reliable BGA assembly using plasma chemical cleaning
Author :
Hagen, R. ; Ramm, J. ; Zeiler, T. ; Goller, B.
Author_Institution :
Siemens AG, Regensburg, Germany
Abstract :
The influence of plasma chemical cleaning (PCC) on wire bonding and molding was investigated. Bonding was performed at the bond pads of semiconductor chips (AlSiCu) and at the Au metallization of ball grid arrays (BGA) from different suppliers. In comparison to untreated reference substrates, plasma cleaning typically improved the bond strength and quality. For some of the BGA carriers, plasma treatment was even necessary to achieve bondability. Destructive tests and metallographic investigations before and after conventional reliability tests demonstrate the positive effect of plasma cleaning. Other investigations showed that plasma treatment improves mold adhesion on BGA substrates. Different solder resists and mold compounds were investigated. The influence of the process parameters on the adhesion and the long-term effect of the plasma treatment was studied. The adhesion of the mold compound was investigated by peel-off tests and scanning acoustic microscopy. Additional contact angle measurements of plasma treated samples demonstrate a remarkable improvement in the adhesion
Keywords :
acoustic microscopy; adhesion; contact angle; encapsulation; integrated circuit interconnections; integrated circuit metallisation; integrated circuit packaging; integrated circuit reliability; lead bonding; mechanical strength; mechanical testing; plasma applications; surface cleaning; surface mount technology; AlSiCu; AlSiCu bond pads; Au; Au BGA metallization; BGA carriers; BGA substrates; adhesion; ball grid arrays; bond quality; bond strength; bondability; contact angle measurements; destructive tests; metallographic analysis; mold adhesion; mold compounds; molding; peel-off tests; plasma chemical cleaning; plasma cleaning; plasma treated samples; plasma treatment; process parameters; reliability tests; reliable BGA assembly; scanning acoustic microscopy; semiconductor chips; solder resists; untreated reference substrates; wire bonding; Adhesives; Assembly; Bonding; Chemicals; Cleaning; Plasma chemistry; Plasma measurements; Substrates; Testing; Wire;
Conference_Titel :
Electronic Packaging Technology Conference, 1997. Proceedings of the 1997 1st
Print_ISBN :
0-7803-4157-0
DOI :
10.1109/EPTC.1997.723883
