DocumentCode
2066444
Title
The simulation of welded microcontact connection of lead and film conductors
Author
Dyachok, Dmytro ; Smerklo, Lubomyr
Author_Institution
Lviv Radio Eng. Res. Inst., Ukraine
fYear
2004
fDate
28-28 Feb. 2004
Firstpage
76
Abstract
The models of face and lay-in microcontact connection of lead and film conductors in integrated circuits and microassemblies are considered. It is shown that electrical resistance is an important informative parameter which allows technical analysis of microcontact connections.
Keywords
electrical contacts; electrical resistivity; equivalent circuits; integrated circuit modelling; lead bonding; Pb; electrical resistance; film conductors; integrated circuits; lead welded microcontact connection; microassemblies; Clamps; Conductive films; Conductivity; Contact resistance; Electric resistance; Equivalent circuits; Microassembly; Thin film circuits; Voltage; Welding;
fLanguage
English
Publisher
ieee
Conference_Titel
Modern Problems of Radio Engineering, Telecommunications and Computer Science, 2004. Proceedings of the International Conference
Conference_Location
Lviv-Slavsko, Ukraine
Print_ISBN
966-553-380-0
Type
conf
Filename
1365875
Link To Document