• DocumentCode
    2066536
  • Title

    Scale in Chip Interconnect requires Network Technology

  • Author

    Wein, Enno

  • Author_Institution
    Arteris, The Network-on-Chip Company, 2033 Gateway Place, San Jose, CA 95110. Email: enno.wein@arteris.com
  • fYear
    2007
  • fDate
    1-4 Oct. 2007
  • Firstpage
    180
  • Lastpage
    186
  • Abstract
    Continued scaling of CMOS has lead to a problem of scale as gates are faster than light travelling across a chip. Scalability used to be the hallmark of CMOS. Half the size, double the speed, half the power etc.. Today, transistors can leak as much current as they drive, and wires are no longer "thin film technology" approximated by plate capacitance over ground. Today wires are much thicker than wide and have significantly more capacitance (-coupling) with their neighbors than over ground. A "short" wire (from one gate to a neighboring one) can be a stub of a few 100nm, while a long wire can connect an IP block with a processor one centimeter away. That is a factor of 100000, which represents a problem of scale and requires fundamentally different solutions. Scalability can be addressed by scaling existing techniques, while problems of scale require new approaches. We discuss problems of scale in the context of chip interconnect.
  • Keywords
    CMOS technology; Capacitance; Clocks; Delay; Joining processes; Network-on-a-chip; Scalability; Thin film transistors; Timing; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Design, 2006. ICCD 2006. International Conference on
  • Conference_Location
    San Jose, CA, USA
  • ISSN
    1063-6404
  • Print_ISBN
    978-0-7803-9707-1
  • Electronic_ISBN
    1063-6404
  • Type

    conf

  • DOI
    10.1109/ICCD.2006.4380813
  • Filename
    4380813