DocumentCode
2066578
Title
On the nature of pad cratering
Author
Godbole, Gaurav ; Roggeman, Brian ; Borgesen, Peter ; Srihari, Krishnaswamy
Author_Institution
Syst. Sci. & Ind. Eng. Dept., SUNY Binghamton, Binghamton, NY
fYear
2009
fDate
26-29 May 2009
Firstpage
100
Lastpage
108
Abstract
Intent was to study the effects and interactions of the main process and environmental factors which are likely to affect pad performance. Real time observation of crack propagation under the pad achieved by cross-sectioning very carefully to the middle of the pad and then subjecting it to cyclic loading revealed some important location dependencies. Experimentation also involved cyclic bending of prepared samples with different preconditioning levels of reflow, moisture and cycling, followed by measurement of the crack area under the pad, post cycling. This shed light on the complex degradation mechanisms at play which did not necessarily have linear dependencies nor were they as basic intuition may have led us to believe. An effort was made to develop an analytical model with the help of multiple regression techniques.
Keywords
cracks; environmental factors; printed circuit manufacture; printed circuit testing; reflow soldering; regression analysis; crack propagation; cyclic loading; environmental factors; multiple regression techniques; pad cratering; pad performance; post cycling; reflow soldering; Assembly; Degradation; Glass; Industrial engineering; Laminates; Particle measurements; Resins; System testing; Thermal stresses; Time measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2009. ECTC 2009. 59th
Conference_Location
San Diego, CA
ISSN
0569-5503
Print_ISBN
978-1-4244-4475-5
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2009.5074003
Filename
5074003
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