• DocumentCode
    2066578
  • Title

    On the nature of pad cratering

  • Author

    Godbole, Gaurav ; Roggeman, Brian ; Borgesen, Peter ; Srihari, Krishnaswamy

  • Author_Institution
    Syst. Sci. & Ind. Eng. Dept., SUNY Binghamton, Binghamton, NY
  • fYear
    2009
  • fDate
    26-29 May 2009
  • Firstpage
    100
  • Lastpage
    108
  • Abstract
    Intent was to study the effects and interactions of the main process and environmental factors which are likely to affect pad performance. Real time observation of crack propagation under the pad achieved by cross-sectioning very carefully to the middle of the pad and then subjecting it to cyclic loading revealed some important location dependencies. Experimentation also involved cyclic bending of prepared samples with different preconditioning levels of reflow, moisture and cycling, followed by measurement of the crack area under the pad, post cycling. This shed light on the complex degradation mechanisms at play which did not necessarily have linear dependencies nor were they as basic intuition may have led us to believe. An effort was made to develop an analytical model with the help of multiple regression techniques.
  • Keywords
    cracks; environmental factors; printed circuit manufacture; printed circuit testing; reflow soldering; regression analysis; crack propagation; cyclic loading; environmental factors; multiple regression techniques; pad cratering; pad performance; post cycling; reflow soldering; Assembly; Degradation; Glass; Industrial engineering; Laminates; Particle measurements; Resins; System testing; Thermal stresses; Time measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2009. ECTC 2009. 59th
  • Conference_Location
    San Diego, CA
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4244-4475-5
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2009.5074003
  • Filename
    5074003