Title :
Reliability assessment of a wirebond chip-on-board package subjected to accelerated thermal cycling loading
Author :
Pang, H.L.J. ; Tan, T.L. ; Leonard, J.F. ; Chen, Y.S.
Author_Institution :
Sch. of Mech. & Production Eng., Nanyang Technol. Univ., Singapore
Abstract :
Accelerated thermal cycling reliability tests were conducted on wire-bond chip-on-board (COB) packages at Delco Electronics. Thermomechanical modeling employing nonlinear finite element analysis was conducted to simulate the thermal cycling induced stresses and strains in the wire-bond interconnection. The FEA simulation study provides deeper insights to the likely failure modes at the wire ball-wedge to silicon die region
Keywords :
finite element analysis; heat treatment; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; integrated circuit reliability; lead bonding; thermal stresses; FEA simulation; accelerated thermal cycling loading; accelerated thermal cycling reliability tests; failure modes; nonlinear finite element analysis; reliability; silicon die; thermal cycling induced stress simulation; thermomechanical modeling; wire ball-wedge; wire-bond COB packages; wire-bond interconnection; wirebond chip-on-board package; Analytical models; Capacitive sensors; Electronic equipment testing; Electronic packaging thermal management; Finite element methods; Life estimation; Thermal conductivity; Thermal stresses; Thermomechanical processes; Wire;
Conference_Titel :
Electronic Packaging Technology Conference, 1997. Proceedings of the 1997 1st
Print_ISBN :
0-7803-4157-0
DOI :
10.1109/EPTC.1997.723892
