DocumentCode :
2066640
Title :
27.8 A 4600μm2 1.5°C (3σ) 0.9kS/s thermal-diffusivity temperature sensor with VCO-based readout
Author :
Rui Quan ; Sonmez, Ugur ; Sebastiano, Fabio ; Makinwa, Kofi A. A.
Author_Institution :
Delft Univ. of Technol., Delft, Netherlands
fYear :
2015
fDate :
22-26 Feb. 2015
Firstpage :
1
Lastpage :
3
Abstract :
Temperature sensors are widely used in microprocessors to monitor on-chip temperature gradients and hot-spots, which are known to negatively impact reliability [1-4]. Such sensors should be: 1) Small to facilitate floor planning; 2) Fast to track millisecond thermal transients and 3) Easy to trim to reduce the associated costs. Recently, it has been shown that thermal diffusivity (TD) sensors can meet these requirements [5]. TD sensors operate by digitizing the temperature-dependent delay associated with the diffusion of heat pulses through an electro-thermal filter (ETF), which, in standard CMOS, can be readily implemented as a resistive heater surrounded by a thermopile. Unlike BJT-based temperature sensors, their accuracy actually improves with CMOS scaling [6], since it is mainly limited by the accuracy of the heater/thermopile spacing, which in turn is determined by lithography. However, the readout circuitry of prior TD sensors has been based on analog phase-domain ΔΣ ADCs, which are not easily ported to low-voltage technologies, and which occupy much more area than the ETF itself [5].
Keywords :
CMOS integrated circuits; delta-sigma modulation; readout electronics; temperature sensors; thermal diffusivity; voltage-controlled oscillators; BJT-based temperature sensor; CMOS scaling; ETF; VCO-based readout; analog phase-domain ΔΣ ADC; electro-thermal filter; lithography; readout circuitry; resistive heater; size 0.16 mum; standard CMOS; thermal-diffusivity temperature sensor; thermopile; Accuracy; CMOS integrated circuits; Modulation; Radiation detectors; Temperature sensors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid- State Circuits Conference - (ISSCC), 2015 IEEE International
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4799-6223-5
Type :
conf
DOI :
10.1109/ISSCC.2015.7063139
Filename :
7063139
Link To Document :
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