• DocumentCode
    2066681
  • Title

    Local thermal characteristics of a confined round jet impinging onto a heated disk

  • Author

    Huang, C.L. ; Shieh, Y.R. ; Hung, Y.H.

  • Author_Institution
    Dept. of Power Mech. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
  • fYear
    1997
  • fDate
    8-10 Oct 1997
  • Firstpage
    108
  • Lastpage
    114
  • Abstract
    In order to achieve reliable MCM cooling with an impinging jet, a suitable jet configuration and surrounding geometry must be selected. An experimental investigation on heat transfer characteristics of an axisymmetric round jet impingement with confinement has been performed. The measurements for these experiments are performed in an axisymmetric mode, and the acquisition of all the experimental data is in steady state. A series of parametric studies are systematically conducted. The three parameters influencing heat transfer performance are jet Reynolds number (Re), ratio of jet separation distance to jet diameter (H/d), and the nozzle tube diameter (d). The ranges of these three parameters studied are Re=973-14051, Wd=1-12, and d=6.15 mm-9.20 mm. Their effects on local thermal characteristics in such a jet-impingement configuration are successively explored in the study
  • Keywords
    confined flow; cooling; integrated circuit packaging; jets; multichip modules; nozzles; thermal analysis; 6.15 to 9.2 mm; MCM cooling; axisymmetric measurement mode; axisymmetric round jet impingement; confined round jet impingement; data acquisition; heat transfer characteristics; heat transfer performance; heated disk; impinging jet; jet Reynolds number; jet configuration; jet diameter; jet geometry; jet separation distance; jet-impingement configuration; local thermal characteristics; nozzle tube diameter; reliable cooling; Computer aided manufacturing; Cooling; Electronic packaging thermal management; Geometry; Heat engines; Heat transfer; Instruments; Mechanical engineering; Performance evaluation; Steady-state;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology Conference, 1997. Proceedings of the 1997 1st
  • Print_ISBN
    0-7803-4157-0
  • Type

    conf

  • DOI
    10.1109/EPTC.1997.723895
  • Filename
    723895