• DocumentCode
    2066825
  • Title

    Power Droop Testing

  • Author

    Polian, Ilia ; Czutro, Alejandro ; Kundu, Sandip ; Becker, Bernd

  • Author_Institution
    Albert-Ludwigs-Univ. Georges-Kohler-Allee, Freiburg
  • fYear
    2007
  • fDate
    1-4 Oct. 2007
  • Firstpage
    243
  • Lastpage
    250
  • Abstract
    Circuit activity is a function of input patterns. When circuit activity changes abruptly, it can cause sudden drop or rise in power supply voltage. This change is known as power droop and is an instance of power supply noise. Although power droop may cause an IC to fail, such failures cannot currently be screened during testing as it is not covered by conventional fault models. In this paper we present a technique for screening such failures. We propose a heuristic method to generate test sequences which create worst-case power drop by accumulating the high-frequency and low-frequency effects. The generated patterns need to be sequential even for scan designs. We employ a dynamically constrained version of the classical D-algorithm for test generation, i.e., the algorithm generates new constraints on-the-fly depending on previous assignments. The obtained patterns can be used for manufacturing testing as well as for early silicon validation. A prototype ATPG is implemented to demonstrate the feasibility of the approach and test sequences are generated for ISCAS circuits.
  • Keywords
    automatic test pattern generation; integrated circuit manufacture; logic testing; automatic test pattern generation; circuit activity; classical D-algorithm; heuristic method; manufacturing testing; power droop testing; power supply voltage; scan design; silicon validation; Circuit faults; Circuit testing; Integrated circuit modeling; Integrated circuit noise; Integrated circuit testing; Manufacturing; Power generation; Power supplies; Silicon; Voltage; ATPG; Power droop; Signal integrity errors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Design, 2006. ICCD 2006. International Conference on
  • Conference_Location
    San Jose, CA
  • ISSN
    1063-6404
  • Print_ISBN
    978-0-7803-9707-1
  • Electronic_ISBN
    1063-6404
  • Type

    conf

  • DOI
    10.1109/ICCD.2006.4380824
  • Filename
    4380824