Title :
Thermo-mechanical stress analysis of PBGA
Author :
Mustain, H.A. ; Hassan, A.Y. ; Seetharamu, K.N.
Author_Institution :
Sch. of Mech. Eng., Univ. Sains Malaysia, Perak
Abstract :
The solder joint reliability is the biggest disadvantage the plastic ball grid array (PBGA) has as compared with other conventional packages. A 2D steady state stress analysis based on the FE method has been carried out to study the most critical item, the solder joint. The parametric studies have been carried out to study the effect of chip length and substrate thickness on the magnitude of the stress in the solder joints. The results indicate that the ball nearest to the die has the highest magnitude of stress and hence is the most critical. These results are expected to act as a database for reliable PBGA design
Keywords :
assembling; finite element analysis; integrated circuit design; integrated circuit modelling; integrated circuit packaging; integrated circuit reliability; plastic packaging; soldering; stress analysis; thermal stresses; 2D steady state stress analysis; FE method; PBGA; chip length effects; plastic ball grid array; reliable PBGA design; solder joint; solder joint reliability; solder joint stress; substrate thickness effects; thermo-mechanical stress analysis; Capacitive sensors; Electronics packaging; Heating; Lead; Plastic packaging; Soldering; Temperature; Thermal stresses; Thermomechanical processes; Transmission line matrix methods;
Conference_Titel :
Electronic Packaging Technology Conference, 1997. Proceedings of the 1997 1st
Print_ISBN :
0-7803-4157-0
DOI :
10.1109/EPTC.1997.723907
