DocumentCode :
2067168
Title :
Optoelectronic-VLSI: direct attachment of photonic devices to silicon VLSI circuits
Author :
Krishnamoorthy, Ashok V.
Author_Institution :
Bell Labs., Lucent Technol., Holmdel, NJ, USA
fYear :
2000
fDate :
2000
Firstpage :
42491
Abstract :
Summary form only given. The goal of OE-VLSI technology is to provide optical interconnects directly to CMOS circuits, thereby harnessing the full processing power of silicon VLSI by solving the electrical interconnection problem where it is most relevant. The technology can be used as a replacement for conventional chip and board-level interconnect, and can also provide new packaging solutions from a chip directly to multiple boards/frames of electronic equipment, or directly from sensors or memory banks to the chip. It is anticipated that the availability of such a technology will allow the production of systems that are competitive, on a cost-per-performance basis, with all-electronic solutions. We describe our work towards the development of a manufacturable OE-VLSI technology, and its applications to new classes of switching and processing systems
Keywords :
optical interconnections; CMOS circuits; Si; direct attachment; optical interconnects; optoelectronic-VLSI; packaging solution; photonic devices; silicon VLSI circuits;
fLanguage :
English
Publisher :
iet
Conference_Titel :
Microdisplay and Smart Pixel Technologies (Ref. No. 2000/006), IEE Seminar on
Conference_Location :
London
Type :
conf
DOI :
10.1049/ic:20000024
Filename :
846978
Link To Document :
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