Innovative approaches in flip chip packaging for mobile applications

In this paper we present new approaches in the development of flip chip technology for mobile platforms. We assess the challenges presented by the use of flip chip interconnection as opposed to the traditional approach of wire bonding and present innovative solutions developed to address those challenges. In particular, we describe innovations in the area of routing-efficient interconnection, bumped wafer handling and thinning methods, mold underfill technology, new substrate technology and approaches for Pb-free packaging.