Title :
Recent advances in surface and thin film analysis methods for application to packaging problems
Author :
von Criegern, Rolf ; Budde, Klaus ; Hoesler, Wolfgang ; Holzapfel, Winfried
Author_Institution :
Siemens AG, Munich, Germany
Abstract :
After a short summary of the “classical” surface analysis methods such as XPS, AES, SIMS, and RBS, a few recent advances in the field of surface and thin film analysis are described that are of relevance for analysis of problems related to packaging technologies. These methods include: chemical state depth profiling with AES, multi-element depth profiling with TOF-SIMS, and three different analytical methods for the sensitive chemical analysis of organic surface contaminations: thermal desorption-gas chromatography/mass spectroscopy (TD-GC/MS), ion mobility spectrometry (IMS), and TOF-SIMS
Keywords :
Auger electron spectra; Rutherford backscattering; X-ray photoelectron spectra; chromatography; electronic equipment testing; mass spectroscopic chemical analysis; packaging; secondary ion mass spectra; spectrochemical analysis; surface contamination; thermally stimulated desorption; time of flight mass spectra; AES; AES chemical state depth profiling; IMS; RBS; SIMS; TD-GC/MS; TOF-SIMS; TOF-SIMS multi-element depth profiling; XPS; ion mobility spectrometry; organic surface contaminations; packaging; packaging technology; sensitive chemical analysis; surface analysis methods; thermal desorption-gas chromatography/mass spectroscopy; thin film analysis methods; Atomic layer deposition; Chemical analysis; Chemical technology; Information analysis; Mass spectroscopy; Optical microscopy; Packaging; Scanning electron microscopy; Surface contamination; Transistors;
Conference_Titel :
Electronic Packaging Technology Conference, 1997. Proceedings of the 1997 1st
Print_ISBN :
0-7803-4157-0
DOI :
10.1109/EPTC.1997.723921
