• DocumentCode
    2067436
  • Title

    An interference miss isolation mechanism based on skewed mapping for shared cache in Chip Multiprocessors

  • Author

    Anwen Huang ; Chao Song ; Wei Guo ; Peng Li ; Minxuan Zhang

  • Author_Institution
    Sch. of Comput. Sci., Nat. Univ. of Defense Technol., Changsha, China
  • fYear
    2013
  • fDate
    28-31 Oct. 2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Inter-thread or intra-thread interference misses may be incurred due to the conflict among different threads when the least-recently-used (LRU) victim candidate is evicted from the shared last level cache in Chip Multiprocessors (CMP). To alleviate this problem, an interference miss isolation mechanism based on skewed mapping (IMI-SM) is proposed for the shared cache in this paper, which is aimed to mitigate the conflict miss phenomena when the on-chip cache is occupied competitively by multiple threads in CMP. The skewed mapping mechanism in IMI-SM is triggered once an interference miss is predicted. The new incoming data fetched from the off-chip memory can be dynamically placed in an dedicated isolation cache or the cache set which is under light pressure, so the negative impact caused by the interference misses in the shared cache is mitigated effectively. Experimental results based on full system simulator demonstrate that IMI-SM can reduce the interference misses in the shared last level cache to a certain extent, and the system performance is improved significantly with negligible hardware overhead.
  • Keywords
    cache storage; interference suppression; microprocessor chips; multiprocessing systems; CMP; IMI-SM; LRU; cache set; chip multiprocessors; dedicated isolation cache; full system simulator; interference miss isolation mechanism; intra-thread interference misses; least-recently-used victim candidate; off-chip memory; on-chip cache; shared cache; skewed mapping mechanism; Artificial intelligence; Benchmark testing; Hardware; Interference; Memory management; Program processors; Tiles;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    ASIC (ASICON), 2013 IEEE 10th International Conference on
  • Conference_Location
    Shenzhen
  • ISSN
    2162-7541
  • Print_ISBN
    978-1-4673-6415-7
  • Type

    conf

  • DOI
    10.1109/ASICON.2013.6811977
  • Filename
    6811977