Experimental modal analysis of PBGA printed circuit board assemblies

Author

Yang, Q.J. ; Lim, G.H. ; Lin, R.M. ; Yap, F.F. ; Pang, H.L.J. ; Wang, Z.P.

Author_Institution

Nanyang Technol. Inst., Singapore

fYear

1997

fDate

8-10 Oct 1997

Firstpage

290

Lastpage

296

Abstract

In order to understand the dynamic properties and develop a valid finite element model of a plastic ball grid array (PBGA) PCB assembly, a series of experimental modal tests have been conducted and reported in this paper. Firstly, the purpose and importance of conducting these experimental modal tests are discussed. Secondly, detailed test results of our PBGA PCB assembly are presented, which can serve as a valuable reference for those who are interested in the vibration fatigue reliability of PBGA PCB assemblies. Lastly, some factors which have an important influence on the modal test results of the PCB assembly are discussed

Keywords

ball grid arrays; circuit reliability; dynamic testing; fatigue; finite element analysis; integrated circuit packaging; modal analysis; plastic packaging; printed circuit testing; vibrational modes; PBGA PCB assembly; PBGA printed circuit board assemblies; PCB assembly; dynamic properties; experimental modal analysis; finite element model; modal tests; plastic ball grid array PCB assembly; vibration fatigue reliability; Assembly; Boundary conditions; Electronic equipment testing; Electronics packaging; Fatigue; Finite element methods; Mechanical factors; Modal analysis; Printed circuits; Vehicle dynamics;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology Conference, 1997. Proceedings of the 1997 1st

Print_ISBN

0-7803-4157-0

Type

conf

DOI

10.1109/EPTC.1997.723924

Filename

723924