Title :
Acoustic microscopy reveals IC packaging hidden defects
Author :
Ong, SH ; Tan, KT ; Tan, K.T.
Author_Institution :
Nat. Semicond., Singapore
Abstract :
This paper highlights the possibilities of nondestructive techniques such as high frequency ultrasonics for location of internal defects and discontinuities in plastic-packaged ICs. C-scan, B-scan, through-scan and signal polarity techniques were employed. These methods can complement each other in enhancing the interpretation of the scanned images. Case studies of detection of delamination between layers, porosity, disbonds, popcorn cracking, and even die cracking when the samples are well oriented towards the ultrasonic beam are presented in this paper. In addition, electrical overstress causing localized carbonized mold compound at bond wires and/or melted metallization on the die surface can be detected
Keywords :
acoustic microscopy; delamination; electrostatic discharge; flaw detection; integrated circuit interconnections; integrated circuit metallisation; integrated circuit packaging; integrated circuit testing; melting; microassembling; plastic packaging; porosity; thermal stress cracking; ultrasonic materials testing; B-scan technique; C-scan technique; IC packaging hidden defects; acoustic microscopy; bond wires; delamination; die cracking; disbonds; discontinuities; discontinuity location; electrical overstress; high frequency ultrasonics; internal defect location; internal defects; localized carbonized mold compound; melted die surface metallization; nondestructive techniques; plastic-packaged ICs; popcorn cracking; porosity; scanned image interpretation; signal polarity technique; through-scan technique; ultrasonic beam; Acoustic transducers; Delamination; Failure analysis; Impedance; Integrated circuit packaging; Metallization; Microassembly; Microscopy; Surface cracks; Wires;
Conference_Titel :
Electronic Packaging Technology Conference, 1997. Proceedings of the 1997 1st
Print_ISBN :
0-7803-4157-0
DOI :
10.1109/EPTC.1997.723925
