• DocumentCode
    2068146
  • Title

    Thermal conductivity of epoxy/surface functionalized carbon nano materials

  • Author

    Liang, Qizhen ; Wang, Wei ; Moon, Kyoung-Sik ; Wong, C.P.

  • Author_Institution
    Sch. of Polymer, Textile & Fiber Eng., Georgia Inst. of Technol., Atlanta, GA
  • fYear
    2009
  • fDate
    26-29 May 2009
  • Firstpage
    460
  • Lastpage
    464
  • Abstract
    Multiwalled carbon nanotubes (MWCNTs) and graphite nanoplates were functionalized by chemical methods. The functionalized chemical structures were characterized by Fourier-Transform Infrared (FTIR). It is found that carboxyl groups were grafted onto MWCNTs and graphite nanoplates surfaces. Epoxy and cyanate ester polymer composites with functionalized MWCNTs and graphite nano plates were prepared, and their thermal conductivities were measured by the a Netzsch Nano Flash, which showed that the thermal conductivity of the polymer composites can be significantly improved by building chemical bondings between polymer matrix and carbon nano fillers.
  • Keywords
    Fourier transform spectra; bonds (chemical); carbon nanotubes; filled polymers; graphite; infrared spectra; thermal conductivity; C; FTIR spectra; Fourier-transform infrared spectra; Netzsch Nano Flash; carboxyl groups; chemical bond; cyanate ester polymer composites; epoxy-surface functionalized carbon nanomaterials; functionalized chemical structures; graphite nanoplates; multiwalled carbon nanotubes; nanofillers; polymer composites; thermal conductivity; Conducting materials; Electronic packaging thermal management; Heat sinks; Materials science and technology; Organic materials; Polymers; Temperature; Thermal conductivity; Thermal management; Thermal resistance; TIM; epoxy composite; functionalized carbon; thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2009. ECTC 2009. 59th
  • Conference_Location
    San Diego, CA
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4244-4475-5
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2009.5074054
  • Filename
    5074054