DocumentCode :
2068172
Title :
The high quality low temperature oxidation technology in a quasi self-aligned SiGe HBT
Author :
Lai, Li-Shyue ; Tseng, Yang-Tai ; Lee, Lurng-Sheng ; Jean, Yuh-Sheng ; Hsu, Yu-Min ; Hang-Ping Hwang ; Lu, Sh-Chii ; Tsai, Ming-Jinn
Author_Institution :
Div. of Semicond. Device Technol., ERSO/ITRI, Taiwan
fYear :
2001
fDate :
2001
Firstpage :
77
Lastpage :
82
Abstract :
A high quality low temperature oxide technology (LTO) was introduced as the emitter/base junction isolation layer of a Silicon-Germanium. (SiGe) HBT. Due to its lower Ge strain relaxation and boron out-diffusion effect, we showed that devices were obtained with a significant improvement in reliability, DC and RF performance in comparison with those fabricated using conventional LTO or thermal oxidation methods
Keywords :
Ge-Si alloys; heterojunction bipolar transistors; isolation technology; microwave bipolar transistors; semiconductor device reliability; semiconductor materials; 12.3 V; 26.3 GHz; 41.8 GHz; B out-diffusion effect; DC performance; Ge strain relaxation; RF performance; SiGe; SiGe HBT; emitter/base junction isolation layer; high base-open breakdown voltage; high quality low temperature oxide technology; life testing; quasi self-aligned HBT; reliability; Capacitive sensors; Germanium silicon alloys; Heterojunction bipolar transistors; Interface states; Isolation technology; MOS capacitors; Oxidation; Radio frequency; Silicon germanium; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices for Microwave and Optoelectronic Applications, 2001 International Symposium on
Conference_Location :
Vienna
Print_ISBN :
0-7803-7049-X
Type :
conf
DOI :
10.1109/EDMO.2001.974287
Filename :
974287
Link To Document :
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