DocumentCode
2068237
Title
Influence of space charge on the breakdown of multilayered epoxy: a study by the thermal step method
Author
Malrieu, S. ; Notingher, Petru ; Pacreau, F. ; Toureille, A.
Author_Institution
Lab. d´´Electrotech., Univ. des Sci. et Tech. du Languedoc, Montpellier, France
Volume
1
fYear
1997
fDate
19-22, Oct 1997
Firstpage
88
Abstract
In this paper, the authors study the part played by the space charge upon the electrical breakdown of a multilayered epoxy used in power electronics. By depositing known charges on the different layers of the sample (the Thermal Step Method applied to a “charged plan” within the insulating structure), we first found the material parameters needed for the mathematical processing of the measure signals (calibration). The samples were then subjected to high electric fields (12.17 to 23.33 kV/mm) at 125°C until breakdown occurred. Periodically, space charge measurements were made using the Thermal Step Method. The measurements were correlated with a Thermally Stimulated Discharge Current experiment, which has given the energy levels of the traps. The results prove that the quantity of space charge increases with the poling time and becomes very important before the breakdown occurrence. Space charge accumulation can therefore be considered as an important factor accelerating polymer degradation and decreasing polymers lifetime
Keywords
electric breakdown; epoxy insulation; space charge; thermally stimulated currents; calibration; charged plan; electrical breakdown; insulating structure; mathematical processing; multilayered epoxy; poling time; polymer degradation; polymer lifetime; power electronics; space charge; thermal step method; thermally stimulated discharge current; trap energy levels; Calibration; Charge measurement; Current measurement; Electric breakdown; Energy measurement; Insulation; Polymers; Power electronics; Signal processing; Space charge;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation and Dielectric Phenomena, 1997. IEEE 1997 Annual Report., Conference on
Conference_Location
Minneapolis, MN
Print_ISBN
0-7803-3851-0
Type
conf
DOI
10.1109/CEIDP.1997.634565
Filename
634565
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