A microstrip array fed by a non-homogeneous stripline feeding network

Using the high-dielectric plugs instead of via-holes eliminates the need for ohmic contact which sometimes is difficult to insure in the vias. This technological process requires one less plating round which considerably reduces the price of the product. All the layers are simultaneously processed and bonded together in the same way striplines circuits are. A 4/spl times/4 microstrip array fed by a feeding network which makes use of this new technology was built and tested.