DocumentCode
2068411
Title
Polarity dependent of gate oxide breakdown from measurements
Author
Shili Wu ; Xiaowei He ; Yuwei Liu ; Guoan Chen
Author_Institution
CSMC Technol. Corp., Wuxi, China
fYear
2013
fDate
28-31 Oct. 2013
Firstpage
1
Lastpage
2
Abstract
In this work, polarity dependent of gate oxide breakdown is investigated for both NMOS and PMOS in a large range of oxide thicknesses, 27Å, 170Å and 850Å. All the devices are measured using constant voltage stress (CVS) method. From the measurements, It is found that for thick gate oxide, lifetime (TBD) under negative gate bias is always shorter regardless of the types of the MOSFETs. However, when the oxide thickness scaled down, the accumulation case gets shorter lifetime than the inversion case for both NMOS and PMOS. In addition, the gate current changes over the stress time for different oxide thicknesses are also exhibited which imply different breakdown processes.
Keywords
MOSFET; semiconductor device breakdown; MOSFET; NMOS; PMOS; constant voltage stress method; gate current; negative gate bias lifetime; polarity dependent gate oxide breakdown; Anodes; Degradation; Electric breakdown; Logic gates; MOS devices; Stress; Substrates;
fLanguage
English
Publisher
ieee
Conference_Titel
ASIC (ASICON), 2013 IEEE 10th International Conference on
Conference_Location
Shenzhen
ISSN
2162-7541
Print_ISBN
978-1-4673-6415-7
Type
conf
DOI
10.1109/ASICON.2013.6812018
Filename
6812018
Link To Document