• DocumentCode
    2068411
  • Title

    Polarity dependent of gate oxide breakdown from measurements

  • Author

    Shili Wu ; Xiaowei He ; Yuwei Liu ; Guoan Chen

  • Author_Institution
    CSMC Technol. Corp., Wuxi, China
  • fYear
    2013
  • fDate
    28-31 Oct. 2013
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    In this work, polarity dependent of gate oxide breakdown is investigated for both NMOS and PMOS in a large range of oxide thicknesses, 27Å, 170Å and 850Å. All the devices are measured using constant voltage stress (CVS) method. From the measurements, It is found that for thick gate oxide, lifetime (TBD) under negative gate bias is always shorter regardless of the types of the MOSFETs. However, when the oxide thickness scaled down, the accumulation case gets shorter lifetime than the inversion case for both NMOS and PMOS. In addition, the gate current changes over the stress time for different oxide thicknesses are also exhibited which imply different breakdown processes.
  • Keywords
    MOSFET; semiconductor device breakdown; MOSFET; NMOS; PMOS; constant voltage stress method; gate current; negative gate bias lifetime; polarity dependent gate oxide breakdown; Anodes; Degradation; Electric breakdown; Logic gates; MOS devices; Stress; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    ASIC (ASICON), 2013 IEEE 10th International Conference on
  • Conference_Location
    Shenzhen
  • ISSN
    2162-7541
  • Print_ISBN
    978-1-4673-6415-7
  • Type

    conf

  • DOI
    10.1109/ASICON.2013.6812018
  • Filename
    6812018