Title :
A parallel optical link for intra- and inter-rack interconnections
Author :
Tan, Q. ; de Pestel, G. ; Willems, G. ; Cannaerts, J. ; Rehm, W. ; Kaiser, N. ; Vandeputte, K. ; Van Hove, A. ; Van Koetem, J.
Author_Institution :
Alcatel Telecom Res. Center, Antwerp, Belgium
Abstract :
This paper presents a re-configurable parallel optical link aiming to solve interconnection problems for the next generation of broadband switching systems in mature technologies at a low cost. The channel re-configuration and interconnections at intra-subrack level are achieved using a flexible or flexible-rigid optical backpanel fabricated in glass optical fiber wiring. Above intra-subrack level, fiber ribbon cables are used to cover a span from a few meters to hundreds of meters. This technology is demonstrated in a multi-channel system, by placing E/O modules in circuit boards and in an application card which is located on the back side of the electrical backpanel. The system employs single mode glass optical fibers, terminated in MT ferrules and MOP connectors. In the presence of a fiber ribbon cable of 204 meters, the demonstrator is able to operate at 622 Mbit/s, with a BER<7×10 -5
Keywords :
optical cables; optical fibre communication; optical fibre couplers; optical fibres; optical interconnections; optical links; 204 m; 622 Mbit/s; E/O modules; MOP connectors; MT ferrules; application card; broadband switching systems; electrical backpanel; fiber ribbon cables; flexible-rigid optical backpanel; glass optical fiber wiring; inter-rack interconnections; intra-rack interconnections; multi-channel system; re-configurable parallel optical link; single mode glass optical fibers; Costs; Flexible printed circuits; Glass; Integrated circuit interconnections; Optical fiber cables; Optical fiber communication; Optical fibers; Optical interconnections; Switching systems; Wiring;
Conference_Titel :
Electronic Components and Technology Conference, 1997. Proceedings., 47th
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-3857-X
DOI :
10.1109/ECTC.1997.606175