Damage prediction for electronic package drop test using finite element method and peridynamic theory

Author

Agwai, Abigail ; Guven, Ibrahim ; Madenci, Erdogan

Author_Institution

Aerosp. & Mech. Eng. Dept., Univ. of Arizona, Tucson, AZ

fYear

2009

fDate

26-29 May 2009

Firstpage

565

Lastpage

569

Abstract

Finite element method and peridynamic theory are coupled via submodeling approach to investigate the dynamic response and damage in an electronic package subjected to impact loading arising from drop-shock. The global modeling is performed using the finite element method while the peridynamic theory is employed for the submodeling and failure prediction. The analysis yielded the outermost solder joint as the critical joint with failure at the interface between the solder and copper pad on the PCB side.

Keywords

copper; dynamic response; electronics packaging; failure analysis; finite element analysis; impact (mechanical); printed circuits; solders; Cu; PCB side; copper pad; damage prediction; drop-shock; dynamic response analysis; electronic package drop test; failure prediction; finite element method; impact loading; peridynamic theory; solder joint; Aerospace electronics; Aerospace engineering; Aerospace testing; Condition monitoring; Electronic equipment testing; Electronics packaging; Finite element methods; Mechanical engineering; Predictive models; Soldering;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2009. ECTC 2009. 59th

Conference_Location

San Diego, CA

ISSN

0569-5503

Print_ISBN

978-1-4244-4475-5

Electronic_ISBN

0569-5503

Type

conf

DOI

10.1109/ECTC.2009.5074069

Filename

5074069