Title :
Damage prediction for electronic package drop test using finite element method and peridynamic theory
Author :
Agwai, Abigail ; Guven, Ibrahim ; Madenci, Erdogan
Author_Institution :
Aerosp. & Mech. Eng. Dept., Univ. of Arizona, Tucson, AZ
Abstract :
Finite element method and peridynamic theory are coupled via submodeling approach to investigate the dynamic response and damage in an electronic package subjected to impact loading arising from drop-shock. The global modeling is performed using the finite element method while the peridynamic theory is employed for the submodeling and failure prediction. The analysis yielded the outermost solder joint as the critical joint with failure at the interface between the solder and copper pad on the PCB side.
Keywords :
copper; dynamic response; electronics packaging; failure analysis; finite element analysis; impact (mechanical); printed circuits; solders; Cu; PCB side; copper pad; damage prediction; drop-shock; dynamic response analysis; electronic package drop test; failure prediction; finite element method; impact loading; peridynamic theory; solder joint; Aerospace electronics; Aerospace engineering; Aerospace testing; Condition monitoring; Electronic equipment testing; Electronics packaging; Finite element methods; Mechanical engineering; Predictive models; Soldering;
Conference_Titel :
Electronic Components and Technology Conference, 2009. ECTC 2009. 59th
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-4475-5
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2009.5074069
