• DocumentCode
    2068603
  • Title

    Adaptive Task Migration Policies for Thermal Control in MPSoCs

  • Author

    Cuesta, David ; Ayala, José L. ; Hidalgo, José I. ; Atienza, David ; Acquaviva, Andrea ; Macii, Enrico

  • Author_Institution
    Complutense Univ., Madrid, Spain
  • fYear
    2010
  • fDate
    5-7 July 2010
  • Firstpage
    110
  • Lastpage
    115
  • Abstract
    In deep submicron circuits, high temperatures have created critical issues in reliability, timing, performance, coolings costs and leakage power. Task migration techniques have been proposed to manage efficiently the thermal distribution in multi-processor systems but at the cost of important performance penalties. While traditional techniques have focused on reducing the average temperature of the chip, they have not considered the effect that temperature gradients have in system reliability. In this work, we explore the benefits of thermal-aware task migration techniques for embedded multi-processor systems. We propose several policies that are able to reduce the average temperature of the chip and the thermal gradients with a negligible performance overhead. With our techniques, hot spots and temperature gradients are decreased up to 30% with respect to state-of-the-art thermal management approaches.
  • Keywords
    microprocessor chips; multiprocessing systems; system-on-chip; thermal management (packaging); MPSoC; adaptive task migration policy; deep submicron circuit; embedded multiprocessor system; high temperature; multiprocessor systems; temperature gradient; thermal aware task migration technique; thermal control; thermal distribution; thermal management; Emulation; Memory management; Program processors; Temperature distribution; Temperature measurement; MPSoCs; Task Migration; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI (ISVLSI), 2010 IEEE Computer Society Annual Symposium on
  • Conference_Location
    Lixouri, Kefalonia
  • Print_ISBN
    978-1-4244-7321-2
  • Type

    conf

  • DOI
    10.1109/ISVLSI.2010.39
  • Filename
    5571796