• DocumentCode
    2068983
  • Title

    Time domain integral equation methods for analysis of transient scattering by composite metallic and dielectric objects

  • Author

    Zhang, G.H. ; Xia, M.Y.

  • Author_Institution
    Sch. of Electron. Eng. & Comput. Sci., Peking Univ., Beijing
  • fYear
    2008
  • fDate
    19-23 May 2008
  • Firstpage
    76
  • Lastpage
    79
  • Abstract
    A stable scheme of the time domain integral equation (TDIE) methods for transient scattering problems by 3D composite metallic and dielectric objects is developed The formulations are deducted by using induced equivalent surface polarization and magnetization as unknown quantities. The time domain electric field integral equation is adopted for conducting part, while the time domain Piggio-Miller-Chang-Harrington-Wu equations are adopted for dielectric part. The Rao-Wilton-Glisson (RWG) triangular spatial basis functions and quadratic 13-spline temporal basis functions are employed. Numerical examples show that the proposed scheme is stable and accurate. The results are found in good agreements with moment method solutions.
  • Keywords
    composite materials; dielectric materials; electric field integral equations; electromagnetic wave scattering; magnetisation; method of moments; splines (mathematics); 3D composite metallic; Rao-Wilton-Glisson triangular spatial basis functions; dielectric objects; electromagnetic scattering; induced equivalent surface polarization; magnetization; moment method solutions; quadratic B-spline temporal basis functions; time domain Piggio-Miller-Chang-Harrington-Wu equations; time domain electric field integral equation methods; transient scattering problems; Dielectrics; Electromagnetic compatibility; Integral equations; Scattering; Time domain analysis; Transient analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility, 2008. APEMC 2008. Asia-Pacific Symposium on
  • Conference_Location
    Singapore
  • Print_ISBN
    978-981-08-0629-3
  • Electronic_ISBN
    978-981-08-0629-3
  • Type

    conf

  • DOI
    10.1109/APEMC.2008.4559815
  • Filename
    4559815