DocumentCode
2068983
Title
Time domain integral equation methods for analysis of transient scattering by composite metallic and dielectric objects
Author
Zhang, G.H. ; Xia, M.Y.
Author_Institution
Sch. of Electron. Eng. & Comput. Sci., Peking Univ., Beijing
fYear
2008
fDate
19-23 May 2008
Firstpage
76
Lastpage
79
Abstract
A stable scheme of the time domain integral equation (TDIE) methods for transient scattering problems by 3D composite metallic and dielectric objects is developed The formulations are deducted by using induced equivalent surface polarization and magnetization as unknown quantities. The time domain electric field integral equation is adopted for conducting part, while the time domain Piggio-Miller-Chang-Harrington-Wu equations are adopted for dielectric part. The Rao-Wilton-Glisson (RWG) triangular spatial basis functions and quadratic 13-spline temporal basis functions are employed. Numerical examples show that the proposed scheme is stable and accurate. The results are found in good agreements with moment method solutions.
Keywords
composite materials; dielectric materials; electric field integral equations; electromagnetic wave scattering; magnetisation; method of moments; splines (mathematics); 3D composite metallic; Rao-Wilton-Glisson triangular spatial basis functions; dielectric objects; electromagnetic scattering; induced equivalent surface polarization; magnetization; moment method solutions; quadratic B-spline temporal basis functions; time domain Piggio-Miller-Chang-Harrington-Wu equations; time domain electric field integral equation methods; transient scattering problems; Dielectrics; Electromagnetic compatibility; Integral equations; Scattering; Time domain analysis; Transient analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility, 2008. APEMC 2008. Asia-Pacific Symposium on
Conference_Location
Singapore
Print_ISBN
978-981-08-0629-3
Electronic_ISBN
978-981-08-0629-3
Type
conf
DOI
10.1109/APEMC.2008.4559815
Filename
4559815
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