Numerical characterization and evaluation of ESD induced field and coupling on interconnection cable

Author

Gao, X.K. ; Li, E.P.

Author_Institution

Inst. of High Performance Comput., Singapore

fYear

2008

fDate

19-23 May 2008

Firstpage

92

Lastpage

95

Abstract

The paper presents a numerical study of the electrostatic discharge and its induced field radiation onto the interconnection cable. The device under test with the cable is modeled by introducing a finite integration technique (FIT) method. The field coupling on signal traces of interconnection cable is simulated. Different configuration of the cable is therefore proposed. The coupled voltages are analyzed and compared. The simulation results are in agreement with practical experiment. The measure to improve the electrostatic discharge immunity of cable is therefore discussed.

Keywords

cables (electric); electrostatic discharge; integration; interconnections; printed circuits; ESD induced field; electrostatic discharge; finite integration technique; induced field radiation; interconnection cable; numerical characterization; Electromagnetic interference; Electromagnetic measurements; Electromagnetic radiation; Electrostatic discharge; Electrostatic interference; Flexible printed circuits; Immune system; Integrated circuit interconnections; Power cables; Voltage; Electromagnetic Interference; Electrostatic Discharge; Radiation coupling; Transmission Line;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility, 2008. APEMC 2008. Asia-Pacific Symposium on

Conference_Location

Singapore

Print_ISBN

978-981-08-0629-3

Electronic_ISBN

978-981-08-0629-3

Type

conf

DOI

10.1109/APEMC.2008.4559819

Filename

4559819