Title :
Practical assessment of tin whisker growth risk due to environmental temperature variations
Author :
Su, Peng ; Lee, C.J. ; Li, Li ; Xue, Jie ; Khan, Boaz ; Moazeni, Reza ; Hartranft, Marc
Author_Institution :
Component Quality & Technol., Cisco Syst., Inc., San Jose, CA
Abstract :
Tin (Sn) whisker growth on semiconductor component leads with pure Sn or high Sn-content plating finishes remains to be a reliability concern for electronic system manufacturers. One of the driving forces for whisker growth is thermal stresses in the finishes induced by environmental temperature variations. These stresses are most significant when the leadframe material and the tin finishes have large differences in coefficient of thermal expansion (CTE) mismatch. As a result, excessive environmental temperature variations can increase the risk of whisker growth.
Keywords :
thermal expansion; thermal stresses; whiskers (crystal); coefficient of thermal expansion mismatch; electronic system reliability; environmental temperature variations; semiconductor component; thermal stresses; tin whisker growth risk; Assembly; Circuit testing; Copper alloys; Lead; Packaging; Performance evaluation; Temperature distribution; Thermal force; Thermal stresses; Tin;
Conference_Titel :
Electronic Components and Technology Conference, 2009. ECTC 2009. 59th
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-4475-5
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2009.5074095
