DocumentCode
2069402
Title
A single branch charge pump without overstress for RFID tag
Author
Lei Cai ; Xiaocheng Gu ; Jiancheng Li ; Chong Huang ; Cong Li ; Qin Qin ; Junping Guo
Author_Institution
Fac. of Mater., Optoelectron. & Phys., Xiangtan Univ., Xiangtan, China
fYear
2013
fDate
28-31 Oct. 2013
Firstpage
1
Lastpage
4
Abstract
Charge pump, which provides high voltage to program the memory cells, is indispensable for the nonvolatile memory (NVM) in radio frequency identification (RFID) tag. This paper presents a charge pump, which adopts single branch topology and is implemented only with PMOSFETs, to fulfill the low cost requirement of RFID tag. By introducing a voltage shift circuit, the voltage difference of adjacent nodes in the charge pump will not exceed the supply voltage (Vdd), which ensures the reliability of charge pump. Furthermore, the bulks of transmission transistors in the charge pump connect with the sources of that by resistances, which can drop the peak of power consumption at the settling time efficiently. A 10 stages charge pump of the proposed topology is implemented in a 0.18-um CMOS standard process, which can pump the supply voltage of 1.5 V to 14.89 V with pure capacitor load at clock frequency of 2 MHz. The charge pump consumes an active die area of 146×76 um2.
Keywords
CMOS integrated circuits; charge pump circuits; integrated circuit reliability; low-power electronics; radiofrequency identification; radiofrequency integrated circuits; CMOS standard process; NVM; PMOSFETs; RFID tag; charge pump reliability; frequency 2 MHz; memory cells; nonvolatile memory; power consumption; radiofrequency identification tag; single branch charge pump; single branch topology; size 0.18 mum; transmission transistors; voltage 1.5 V to 14.89 V; voltage shift circuit; Capacitance; Charge pumps; Clocks; MOSFET; Radiofrequency identification; Topology; RFID; body effect; charge pump; overstress;
fLanguage
English
Publisher
ieee
Conference_Titel
ASIC (ASICON), 2013 IEEE 10th International Conference on
Conference_Location
Shenzhen
ISSN
2162-7541
Print_ISBN
978-1-4673-6415-7
Type
conf
DOI
10.1109/ASICON.2013.6812055
Filename
6812055
Link To Document