A novel multilayer/3d technology for advanced microwave and millimetre-wave wireless circuits and systems

This paper describes the realization of compact and high performance microwave and millimeter-wave circuits and modules at a low cost for advanced wireless applications using a novel multialyer/3D photoimageable thick film technology. The multilayer substrate integrated waveguide (SIW) demonstrates extremely low loss up to 110 GHz and beyond and is suitable to replace planar transmission lines beyond 60 GHz. Highly compact and high SRF multilayer lumped components have been designed and modeled up to 40 GHz with excellent performance. A 3 GHz lumped element filter has remarkably low pass band loss of 0.3 dB with high stop band attenuation (> 40 dB), and yet is highly miniaturized, representing one of the highest components performance ever reported in multichip module (MCM) technologies. The multilayer passive components have been designed and characterized up to 80 GHz and the performances are superior to most of the reported results from conventional MCM technologies and comparable to costlier thin film technology. Further, a highly compact multilayer complete receiver at 60 GHz has been realised using a novel integration technique and integrating MMICs with SIW filter and antenna and other passives onto a single substrate, with remarkably high performance and miniaturization.