• DocumentCode
    2069710
  • Title

    Practical analysis on 20H rule for PCB

  • Author

    Ikami, Shinichi ; Sakurai, Akihisa

  • Author_Institution
    Yamato Lab., IBM Japan, Yamato
  • fYear
    2008
  • fDate
    19-23 May 2008
  • Firstpage
    180
  • Lastpage
    183
  • Abstract
    There are many papers dealing with the 20-H rule, which recommend that the power plane should be shrunk against the ground plane by 20 times of the distance between the planes to realize lower EMI radiation. The effect of the 20-H rule was studied with EM solver using MoM. Bypass capacitors were populated to simulate a realistic printed circuit board (PCB). From the evaluation of the electric and magnetic dipole moment, the contributions of common and differential modes current were calculated. It was found that common mode current in the ground plane was generated when the 20H rule was applied. At the resonance frequencies, the common and differential mode radiations are observed in accordance with its resonance mode, the common mode radiation due to y- or x-directional electric dipole moment for TM01 or TM10 respectively. Considering the common mode current occurrence is a fundamental mechanism of the electromagnetic radiation, it is concluded that the application of the rule increases the radiation.
  • Keywords
    capacitors; electromagnetic interference; method of moments; printed circuits; Bypass capacitors; EMI radiation; MoM; PCB; common modes current; differential modes current; electric dipole moment; magnetic dipole moment; printed circuit board; resonance frequencies; Capacitors; Circuit simulation; Dielectric substrates; Electromagnetic interference; Electromagnetic radiation; Laboratories; Large scale integration; Magnetic resonance; Noise shaping; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility, 2008. APEMC 2008. Asia-Pacific Symposium on
  • Conference_Location
    Singapore
  • Print_ISBN
    978-981-08-0629-3
  • Electronic_ISBN
    978-981-08-0629-3
  • Type

    conf

  • DOI
    10.1109/APEMC.2008.4559841
  • Filename
    4559841