Title :
Study of mounting fine pitch IC chips and passive components with Elasticity Bonding System
Author :
Kojima, Ryoji ; Matsumura, Takashi ; Furuta, Kazutaka ; Hamazaki, Kazunori ; Nishimura, Junichi ; Suga, Yasuhiro ; Takeichi, Motohide
Author_Institution :
Sony Chem. & Inf. Device Corp., Kanuma
Abstract :
Elasticity Bonding System (EBS) is newly developed flip chip bonding method using thermosetting film-shaped resin as adhesive and elastic body as bonding tool. Unlike conventional Anisotropic Conductive Film (ACF) and Non Conductive Film (NCF) method, EBS can bond multi-chip, passive and IC chips simultaneously, because elastic body absorbs their difference in height and inclination.
Keywords :
elasticity; fine-pitch technology; integrated circuit bonding; integrated circuit reliability; conductive resistance reliability; elasticity bonding system; mounting fine pitch IC chips; passive components; pressure cooker test; temperature 100 degC; temperature cycle test; Anisotropic conductive films; Bonding forces; Conductive films; Elasticity; Flip chip; Moisture; Resins; Substrates; Temperature; Testing;
Conference_Titel :
Electronic Components and Technology Conference, 2009. ECTC 2009. 59th
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-4475-5
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2009.5074133
