Title :
Modelling of the power pin diode under surge current conditions
Author :
Nowak, J. ; Bakowski, M. ; Lisik, Z. ; Wozny, J. ; Owczarek, M.
Author_Institution :
Dept. of Microelectron. & Inf. Technol., R. Inst. of Technol., Kista, Sweden
Abstract :
Fast recovery silicon (Si) power diodes, having radiation induced recombination centres, operating under forward bias at large current densities and high temperatures, have been studied in a detailed way, both experimentally and with the help of device simulation Medici package. The comparison of the dynamic I-V characteristics with the results of numerical simulations is possible only when all the specific features of the measurement set-up are taken into account in the simulations. Such evaluation of the electro-thermal numerical model of the diode under experiment combined with the electro-thermal model of the experimental set-up as the boundary condition for Medici simulation is being presented. The main issue is the definition of the thermal boundary conditions.
Keywords :
current density; electron-hole recombination; elemental semiconductors; numerical analysis; p-i-n diodes; power semiconductor diodes; semiconductor device models; silicon; surges; Medici package; Si; current density; dynamic I-V characteristics; electro-thermal numerical model; fast recovery silicon power diodes; forward bias; modelling; numerical simulations; power pin diode; radiation induced recombination centres; surge current conditions; thermal boundary conditions; Boundary conditions; Current density; Diodes; Medical simulation; Numerical models; Numerical simulation; Packaging; Silicon; Surges; Temperature;
Conference_Titel :
Modern Problems of Radio Engineering, Telecommunications and Computer Science, 2004. Proceedings of the International Conference
Conference_Location :
Lviv-Slavsko, Ukraine
Print_ISBN :
966-553-380-0