DocumentCode :
2070766
Title :
Effect of arc behavior on material transfer: a review
Author :
Chen, Zhuan-Ke ; Sawa, Koichiro
Author_Institution :
Dept. of Electr. Eng., Keio Univ., Yokohama, Japan
fYear :
1996
fDate :
16-20 Sept. 1996
Firstpage :
238
Lastpage :
251
Abstract :
One of the serious problems of arcing in relays and switches is leading to material transfer, thus resulting in the loss of contact material and the early end of lifetime. Although this phenomenon has been studied for many years, there are still many unsolved problems. This paper is a review of material transfer due to arcing based on published work by the authors and by the other investigators. Included are a discussion of transfer mechanism, called PSD model (particle sputtering and deposition model); a survey of contact materials, circuit parameters, electrode temperatures, and surrounding gases which have been determined to affect arc behavior and material transfer; the effect of contact surface temperature distribution, arc spot dimension, arc root stability, and arc duration on wearout or loss of contact material from two contacts; and an idea of balance transfer ("zero" loss) operation. It is expected that this paper could supply some basic considerations for controlling material transfer in practical applications.
Keywords :
arcs (electric); circuit-breaking arcs; electrical contacts; electrodes; relays; switches; temperature distribution; wear; PSD model; arc behavior; arc duration; arc root stability; arc spot dimension; arcing; balance transfer; circuit parameters; contact material; contact surface temperature distribution; electrode temperatures; material transfer; relays; switches; wearout; Arc discharges; Circuits; Contacts; Electrodes; Gases; Relays; Reliability engineering; Sputtering; Switches; Temperature distribution;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Contacts, 1996. Proceedings of the Forty-Second IEEE Holm Conference on ??. Joint with the 18th International Conference on Electrical Contacts
Conference_Location :
Chicago, IL, USA
Print_ISBN :
0-7803-3578-3
Type :
conf
DOI :
10.1109/HOLM.1996.557203
Filename :
557203
Link To Document :
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