A low-cost wire-bonding package design with package built-in three-dimensional distributed matching circuit for over 5Gbps SerDes applications

The package built-in three-dimensional distributed matching circuit[1], which had been developed for FCBGA , has been extended to the low-cost wire-bonding packages. The two-metal layer package designed for 6.4 Gps SerDes (Serializer-Deserializer) achieved a ~4 dB return loss improvement as well as better signal waveform compared to the normal 50-Ohm design. In addition, signal-power coupling effect on the high-speed SerDes device has been analyzed for the first time based on the full-wave, full-3D, signal-power-combined electromagnetic analysis, which suggests that the power integrity design substantially affects the common mode noise generation inside the wire-bonding packages of high-speed SerDes devices.