DocumentCode :
2070862
Title :
Equalization of mid-frequency power supply noise via a spectrum-shaping encoder for parallel buses
Author :
Wilson, John ; Abbasfar, Aliazam ; Ren, Jihong ; Werner, Carl ; Oh, Dan ; Kim, Joong-Ho ; Luo, Lei ; Eble, John ; Kizer, Jade
Author_Institution :
Rambus, Inc., Chapel Hill, NC
fYear :
2009
fDate :
26-29 May 2009
Firstpage :
1122
Lastpage :
1126
Abstract :
Noise from the simultaneous switching of outputs (SSO) creates a significant problem for high-speed parallel buses that use single-ended signaling. Further exacerbating this problem is the fact that many single-ended interfaces share the return path of numerous signals with the same power delivery network (PDN) used to power the I/O transceiver circuitry. These single-ended interfaces share power and ground conductors in an effort to reduce the cost associated with package pin count and chip pad area. In addition to creating low-cost interfaces, there is a need for performance enhancing techniques that are ldquointerface compatiblerdquo, which helps to ease their adoption. This paper introduces a new concept in bus coding that shapes the spectrum of aggregate bus current in an effort to ldquoequalizerdquo the induced voltage response of a power supply. The single-ended buses discussed in this paper are those used in the industry standard interfaces of today´s graphics systems, and possibly the interfaces that may be used in future generations of main memory.
Keywords :
circuit noise; encoding; field buses; power supply circuits; I-O transceiver circuitry; aggregate bus current spectrum; chip pad area; equalization; mid-frequency power supply noise; package pin count; parallel buses; power delivery network; single-ended interfaces; single-ended signaling; spectrum-shaping encoder; Aggregates; Circuits; Conductors; Costs; Electricity supply industry; Packaging; Power supplies; Shape; Transceivers; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2009. ECTC 2009. 59th
Conference_Location :
San Diego, CA
ISSN :
0569-5503
Print_ISBN :
978-1-4244-4475-5
Electronic_ISBN :
0569-5503
Type :
conf
DOI :
10.1109/ECTC.2009.5074152
Filename :
5074152
Link To Document :
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