Title :
A Study on crosstalk analysis in aggregative transmission lines with turning vias
Author :
Bandyopadhyay, Tapobrata ; Shan, Lei ; Kwark, Young ; Ritter, Mark ; Gu, Xiaoxiong ; Baks, Christian ; John, Richard ; Tummala, Rao
Author_Institution :
Georgia Inst. of Technol., Atlanta, GA
Abstract :
This paper presents measurement, modeling and simulation studies of high-speed signal propagation in multi-layered PCB with turning vias (immediate layer changing) in a mixed-referencing environment. The effects of turning vias, plane referencing, decoupling capacitor placement and, panel dimensions on high-speed signal propagation in an organic board are studied.
Keywords :
capacitors; crosstalk; printed circuits; telecommunication transmission lines; aggregative transmission line; crosstalk analysis study; decoupling capacitor placement; high-speed signal propagation; mixed-referencing environment; multilayered PCB turning vias effect; panel dimension; Capacitors; Circuit noise; Crosstalk; Power system modeling; Power transmission lines; Signal analysis; Testing; Transmission lines; Turning; Vehicles;
Conference_Titel :
Electronic Components and Technology Conference, 2009. ECTC 2009. 59th
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-4475-5
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2009.5074162
