• DocumentCode
    2071216
  • Title

    Yield analysis for repairable embedded memories

  • Author

    Sehgal, Anuja ; Dubey, Aishwarya ; Marinissen, Erik Jan ; Wouters, Clemens ; Vranken, Harald ; Chakrabarty, Krishnendu

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Duke Univ., Durham, NC, USA
  • fYear
    2003
  • fDate
    25-28 May 2003
  • Firstpage
    35
  • Lastpage
    40
  • Abstract
    Repairable embedded memories help improve the overall yield of an IC. We have developed a yield analysis tool that provides realistic yield estimates for both single repairable memories, as well as for ICs containing multiple, possibly different, repairable embedded memories. Our approach uses pseudo-randomly generated fault bit-maps, which are based on memory area size, defect density, and fault distribution. In order to accommodate a wide range of industrial memory and redundancy organizations, we have developed a flexible memory model. It generalizes the traditional simple memory matrix model with partitioning into regions, grouping of columns and rows, and column-wise and row-wise coupling of the spares. Our tool is used to determine an optimal amount of spare columns and rows for a given memory, as well as to determine the effectiveness of various repair algorithms.
  • Keywords
    integrated circuit design; integrated circuit modelling; integrated circuit testing; integrated circuit yield; integrated memory circuits; logic design; logic testing; redundancy; column grouping; defect density; fault distribution; memory area size; memory design; memory matrix model; memory test; pseudo-randomly generated fault bit-maps; redundancy organizations; repair algorithm effectiveness; repairable embedded memories; row grouping; spare column-wise coupling; spare row-wise coupling; yield analysis tool; yield estimates; Algorithm design and analysis; Automatic testing; Circuit faults; Circuit testing; Heuristic algorithms; Manufacturing industries; Partitioning algorithms; Redundancy; Silicon; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Workshop, 2003. Proceedings. The Eighth IEEE European
  • ISSN
    1530-1877
  • Print_ISBN
    0-7695-1908-3
  • Type

    conf

  • DOI
    10.1109/ETW.2003.1231666
  • Filename
    1231666