DocumentCode :
2071380
Title :
Jitter suppressed on-chip clock distribution using package plane cavity resonance
Author :
Lee, Woojin ; Ryu, Chunghyun ; Park, Jongbae ; Kim, Joungho
Author_Institution :
Dept. of EECS, Korea Adv. Inst. of Sci. & Technol., Daejeon
fYear :
2008
fDate :
19-23 May 2008
Firstpage :
427
Lastpage :
430
Abstract :
This paper presents a chip-package hybrid clock distribution network using package or PCB plane cavity resonance. This structure enhances Q factor through low loss plane cavity and lowers phase noise. A voltage-controlled oscillator generates clock signal and off-chip driver circuit with the structure of harmonic rejection mixer excites the plane resonance. The plane cavity resonator consists of the embedded planes in package and an inductive load. The resonant frequency can be controlled by the inductance and the various destination points like local buffers can be connected to the plane. We simulate the proposed chip-package co-design with the transmission line matrix modelling and the simulation results show that the source jitter is suppressed by the resonance effect.
Keywords :
Q-factor; circuit resonance; clocks; electronics packaging; inductance; integrated circuit interconnections; jitter; transmission line matrix methods; PCB plane cavity resonance; Q factor; chip-package hybrid clock distribution network; harmonic rejection mixer; jitter suppression; local buffers; off-chip driver circuit; on-chip clock distribution; package plane cavity resonance; transmission line matrix modelling; voltage-controlled oscillator; Clocks; Driver circuits; Jitter; Packaging; Phase noise; Q factor; Resonance; Signal generators; Transmission line matrix methods; Voltage-controlled oscillators;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility, 2008. APEMC 2008. Asia-Pacific Symposium on
Conference_Location :
Singapore
Print_ISBN :
978-981-08-0629-3
Electronic_ISBN :
978-981-08-0629-3
Type :
conf
DOI :
10.1109/APEMC.2008.4559903
Filename :
4559903
Link To Document :
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