• DocumentCode
    2071517
  • Title

    A 35 GHz reduced-size bandpass filter based on SIW in LTCC technology

  • Author

    Bingyao Liu ; Jianming Zhou ; Ruobing Liu ; Qiong Wu ; Kunpeng Zhang

  • Author_Institution
    Sch. of Inf. & Electron., Beijing Inst. of Technol., Beijing, China
  • fYear
    2013
  • fDate
    25-28 Aug. 2013
  • Firstpage
    77
  • Lastpage
    80
  • Abstract
    This paper presents a bandpass filter composed of cavities delimited in a Low Temperature Co-fired Ceramic (LTCC) substrate by a periodic lattice of metallic via-holes. Compared with the conventional two dimensional PCB, LTCC technology achieves higher Q factor, higher density, smaller size, and lower cost[1]. I/O coplanar waveguide (CPW) feeds are printed on the top face of the substrate and are suitable for planar circuit integration. EM simulator HFSS is employed in determining and optimizing the physical dimension of the filter. In this paper, a planar four-pole linear phase filter centered at 35 GHz based on substrate integrated waveguide (SIW) is proposed. The filter´s fractional bandwidth (FBW) is 10% with insertion loss of -0.65 dB and return loss of -20 dB.
  • Keywords
    band-pass filters; cavity resonator filters; coplanar waveguides; linear phase filters; millimetre wave filters; substrate integrated waveguides; waveguide filters; CPW feeds; EM simulator HFSS; I/O coplanar waveguide; LTCC technology; Q factor; SIW; frequency 35 GHz; loss -0.65 dB; loss -20 dB; low temperature co-fired ceramic substrate; metallic via-holes; periodic lattice; planar circuit integration; planar four-pole linear phase filter; reduced-size bandpass filter; substrate integrated waveguide; two dimensional PCB; Band-pass filters; Cavity resonators; Couplings; Filtering theory; Microwave filters; Resonant frequency; Substrates; Bandpass Filter; LTCC; Resonant Cavity; SIW; metallic post;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Technology & Computational Electromagnetics (ICMTCE), 2013 IEEE International Conference on
  • Conference_Location
    Qingdao
  • Type

    conf

  • DOI
    10.1109/ICMTCE.2013.6812391
  • Filename
    6812391