Analysis of mixed CNT bundle interconnects: Impact on delay and power dissipation

Author

Majumder, Manoj Kumar ; Kaushik, B.K. ; Manhas, Sanjeev Kumar

Author_Institution

Dept. of Electron. & Comput. Eng., Microelectron. & VLSI Group, Indian Inst. of Technol. Roorkee, Roorkee, India

fYear

2012

fDate

17-19 Dec. 2012

Firstpage

1

Lastpage

4

Abstract

This research paper proposes a hierarchical modelling approach for mixed carbon nanotube (CNT) bundle (MCB) interconnects. Based on the arrangements of single-walled CNTs (SWCNT) and multi-walled CNTs (MWCNTs), three different MCB structures are proposed. Transient analysis is performed for bundled CNT structures to address the effect of propagation delay and power dissipation. It has been observed that the delay and power dissipation are significantly improved for the proposed MCB structures as compared to bundled SWCNT and bundled MWCNT at different global interconnect lengths.

Keywords

carbon nanotubes; delays; interconnections; transient analysis; MWCNT-MCB structure; delay impact; global interconnect lengths; mixed CNT bundle interconnect analysis; mixed carbon nanotube bundle interconnects; multiwalled CNT; power dissipation; propagation delay effect; single-walled CNT; transient analysis; Carbon nanotube (CNT); interconnects; mixed CNT bundle (MCB); power dissipation; propagation delay;

fLanguage

English

Publisher

ieee

Conference_Titel

Computers and Devices for Communication (CODEC), 2012 5th International Conference on

Conference_Location

Kolkata

Print_ISBN

978-1-4673-2619-3

Type

conf

DOI

10.1109/CODEC.2012.6509356

Filename

6509356