Title :
122 GHz antenna-integration in a plastic package based on a flip chip interconnect
Author :
Beer, Stefan ; Zwick, Thomas
Author_Institution :
Inst. fuer Hochfrequenztech. und Elektron., Karlsruhe Inst. of Technol., Karlsruhe, Germany
Abstract :
The paper introduces a packaging concept for the integration of a 122 GHz MMIC and a separate off-chip antenna into a plastic QFN package. The concept is explained and the advantages compared to previous concepts are given. As the concept incorporates a 122 GHz chip to antenna interconnect based on flip chip technology, measurements and simulations of such an interconnect are presented to evaluate the performance. Finally, a possible antenna design is presented together with the measurement results of this antenna.
Keywords :
MIMIC; MMIC; flip-chip devices; integrated circuit interconnections; integrated circuit packaging; millimetre wave antennas; plastic packaging; MMIC; antenna design; antenna integration; antenna interconnect; flip chip interconnect; frequency 122 GHz; off-chip antenna; plastic QFN package; Antenna measurements; Antennas; Cavity resonators; Flip chip; Semiconductor device measurement; Substrates; Transmission line measurements; Millimeter-waves; flip chip; integrated antenna; packaging;
Conference_Titel :
Microwave Workshop Series on Millimeter Wave Integration Technologies (IMWS), 2011 IEEE MTT-S International
Conference_Location :
Sitges
Print_ISBN :
978-1-61284-963-8
DOI :
10.1109/IMWS3.2011.6061881
