• DocumentCode
    2072282
  • Title

    Deflection routing in 3D Network-on-Chip with TSV serialization

  • Author

    Jinho Lee ; Dongwoo Lee ; Sunwook Kim ; Kiyoung Choi

  • Author_Institution
    Sch. of Electr. Eng. & Comput. Sci., Seoul Nat. Univ., Seoul, South Korea
  • fYear
    2013
  • fDate
    22-25 Jan. 2013
  • Firstpage
    29
  • Lastpage
    34
  • Abstract
    This paper proposes a deflection routing for 3D NoC with serialized TSVs. Bufferless deflection routing provides area- and power-efficient communication under low to medium traffic load. Under 3D circumstances, the bufferless deflection routing can yield even better performance than buffered routing when key aspects are properly taken into account. Evaluation of the proposed scheme shows its effectiveness in throughput, latency, and energy consumption.
  • Keywords
    network-on-chip; three-dimensional integrated circuits; 3D NoC; 3D network on chip; TSV serialization; bufferless deflection routing; energy consumption; latency; power efficient communication; serialized TSV; Bandwidth; Ports (Computers); Routing; System recovery; Three-dimensional displays; Through-silicon vias; Throughput;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference (ASP-DAC), 2013 18th Asia and South Pacific
  • Conference_Location
    Yokohama
  • ISSN
    2153-6961
  • Print_ISBN
    978-1-4673-3029-9
  • Type

    conf

  • DOI
    10.1109/ASPDAC.2013.6509554
  • Filename
    6509554
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2072282