Title :
Post-dicing particle control for 3D stacked IC integration flows
Author :
Bearda, Twan ; Travaly, Youssef ; Wostyn, Kurt ; Halder, Sandip ; Swinnen, Bart ; Mölders, Thomas ; Varghese, Ivin ; Cheng, Paul
Author_Institution :
IMEC, Leuven
Abstract :
The concept of 3D integration aims at low cost and high yield processes. For this reason, cleanliness is a concern in process steps such as bonding. However, preceding process steps like dicing and die-level handling are traditionally associated with high levels of contamination. Usually a clean prior to the bonding step will be required. We discuss the requirements of the cleaning process, and explore defect inspection and cryogenic cleaning as viable solutions.
Keywords :
bonding processes; cleaning; cryogenics; microassembling; 3D stacked integrated circuit; bonding; cleaning process; cryogenic cleaning; die level handling; post dicing particle control; Boundary conditions; Cleaning; Contacts; Contamination; Cryogenics; Delamination; Inspection; Microscopy; Through-silicon vias; Wafer bonding;
Conference_Titel :
Electronic Components and Technology Conference, 2009. ECTC 2009. 59th
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-4475-5
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2009.5074213
