DocumentCode
2072772
Title
Self-assembly of micro-parts using electrostatic forces and surface tension
Author
Dalin, Johan ; Wilde, J.
Author_Institution
Dept. of Microsyst. Eng., Univ. of Freiburg-IMTEK, Freiburg
fYear
2009
fDate
26-29 May 2009
Firstpage
1517
Lastpage
1524
Abstract
This investigation regards self-assembly of parts by means of electrostatic forces and surface tension. Self-assembly is a rather novel technology to assemble and align small parts on a substrate without the help of additional machinery. Mainly, the state-of-the-art technologies for self-assembly rely on fundamental physical principles, such as surface tenisons, electrostatic forces or gravitational force. Future perspectives are integration of photonic devices and assembly of electronic micro-systems. The present publication discusses two different concepts. One has been described in the literature by third parties and involves the alignment of parts by utilising the surface tensions of small adhesive pads, which are selectively coated on hydrophobic alignment structures. Especially, how the layout of such alignment structures and their dimensions affect the process flow have been considered in the present investigation. The second concept is a novel approach to accomplish self-alignment of micro-structures with electrostatic attraction. Several complementary and electrically conductive micro-structured patterns serve as binding sites for the alignment in this approach. Since the fluidic medium is an adhesive in the presented experimental work it is conceivable to permanently bound the part to the substrate when the alignment has been accomplished. Firstly, modelling and computations have revealed the magnitude of the alignment forces, acting on parts, for these approaches. Secondly, self-assembly experiments have demonstrated their feasibility. For processes that utilise electrostatic forces the experimental work with a variety of binding sites with different shapes and sizes has revealed promising results. Parts, comprising 4.5times103 structured square-shaped binding sites with a size of 10times10 mum2, were successfully self-aligned in experiments. Furthermore, parts with alignment structures with a size of 1000 mum2 and a surf- ce area ratio of the alignment structures to the entire part of about 2% could be aligned successfully. The fact that only a small area of the part has to be covered with alignment structures is unique in comparison to related research. Finally, modelling and computations have approved that electrostatic forces can be considerably stronger than surface-tension-driven forces.
Keywords
adhesives; electrostatics; hydrophobicity; microfabrication; micromechanical devices; self-assembly; surface tension; adhesive pads; binding sites; complementary micro-structured patterns; electrically conductive micro-structured patterns; electrostatic attraction; electrostatic forces; fluidic medium; hydrophobic alignment structures; micro-parts; micro-structures; self-assembly; surface tension; Assembly; Computational modeling; Electrostatics; Laboratories; Machinery; Packaging machines; Self-assembly; Substrates; Surface tension; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2009. ECTC 2009. 59th
Conference_Location
San Diego, CA
ISSN
0569-5503
Print_ISBN
978-1-4244-4475-5
Type
conf
DOI
10.1109/ECTC.2009.5074214
Filename
5074214
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